| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin package for surface mounting light-emitting device composed of a white thermosetting composition which does not induce deterioration of mold surface even after long period continuous molding, and to provide a surface mounting light-emitting device.SOLUTION: A resin molding 4 for surface mounting light-emitting device consists of a molding of white thermosetting composition having a recess 13 for mounting an optical semiconductor element, and at least a part of the recess uses zinc oxide as a white pigment. A resin hardening body obtained by hot pressing and then hardening a white thermosetting composition has an optical reflectance of 80% or more at 460 nm.SELECTED DRAWING: Figure 4 |
