Cu PASTE COMPOSITION AND THICK FILM CONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a Cu paste composition capable of improving sulfur resistance of a thick film electrode or a thick film wiring formed by applying same on a surface of a substrate and firing and capable of enhancing reliability of an electronic component or an electronic circuit.SOLUTION: There is provided a method for providing a Cu paste composition by mixing a Cu powder, a Ni powder and an organic vehicle with 0.7 to 20 pts.mass of the Ni powder and 5 to 40 pts.mass of the organic vehicle based on total 100 pts.mass of the Cu power and the Ni powder to obtain the Cu paste composition and mixing CuO powder of 1 to 15 pts.mass additionally.SELECTED DRAWING: Figure 1