发明名称 METHOD AND APPARATUS FOR USE IN THERMAL COUPLED ANALYSIS
摘要 In a method of carrying out thermal computational fluid dynamics - thermal CFD - analysis on a structure comprising a first part, a second part and a deformable third part located between and in contact with each of the first and second parts, a thermal CFD model of the structure is created using 3D-CAD software in which a volume of the structure, encompassing the third part, a portion of the first part which is adjacent to and includes a boundary between the first and third parts, and a portion of the second part which is adjacent to and includes a boundary between the second and third parts, is replaced by a notional fourth part, which has a uniform thickness greater than or equal to twice the size of mesh used to mesh the first and second parts. The shape of the third part as deformed under load is derived from structural analysis of a structural analysis model of the structure, and then a value for the thermal conductivity of the fourth part is calculated, based on a known value of the thickness of the fourth part, a known value of the thickness of the third part, the derived shape of the deformed third part, a known value of the thermal conductivity of the third part, and known values of the thermal conductivity of the portions of the first and second parts. Thermal-CFD analysis of the thermal CFD model is carried out using the calculated thermal conductivity of the fourth part.
申请公布号 EP3089057(A3) 申请公布日期 2016.12.21
申请号 EP20160157990 申请日期 2016.03.01
申请人 FUJITSU LIMITED 发明人 KUBOTA, Tetsuyuki;CHOW, Peter;GEORGESCU, Serban;AKIHIKO, Fujisaki
分类号 G06F17/50 主分类号 G06F17/50
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