| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for attaching a chip to a substrate, on which a mark is not put although positioning by marking is employed, with high positioning accuracy.SOLUTION: A method for positioning an object on a substrate includes step S11 for preparing a substrate support having a substrate supporting surface for supporting the substrate, and a substrate support side mark put at a predetermined position on the substrate supporting surface, step S12 for preparing the object having a mark region in which an object side mark is put, step S13 for attaching a transparent substrate onto the substrate supporting surface of the substrate support, and step S14 for positioning the object on the substrate by using light transmitting through the substrate and the mark region of the object in a direction substantially perpendicular to the substrate supporting surface of the substrate support, recognizing the images of the substrate support side mark and the object side mark, thereby measuring and correcting a relative position error between the object and substrate. |
