发明名称 Control device and method for producing a control device for a motor vehicle
摘要 A control device includes a first circuit carrier with electrical components that are electrically conductively connected to one another and a second circuit carrier with electrical components that are electrically conductively connected to one another. The first circuit carrier and the second circuit carrier are electrically conductively connected to one another. The second circuit carrier is fixedly connected in thermally conductive fashion to a fluid-tight thermally conductive carrier element. The second circuit carrier and the carrier element are arranged in a cutout of the first circuit carrier. The carrier element has better thermal conductivity than the first circuit carrier and can be thermally conductively connected to a heat sink. The carrier element is integrated in fluid-tight fashion in an internal region of the first circuit carrier.
申请公布号 US9642288(B2) 申请公布日期 2017.05.02
申请号 US201214367180 申请日期 2012.11.14
申请人 Robert Bosch GmbH 发明人 Liskow Uwe;Klobes Peter;Meier Thomas
分类号 H05K7/00;H05K5/00;H05K7/20;F16H61/00;H05K1/02;H05K3/30;H05K1/14 主分类号 H05K7/00
代理机构 Maginot, Moore & Beck LLP 代理人 Maginot, Moore & Beck LLP
主权项 1. A control device for a motor vehicle, comprising: a first circuit mount including electrical components that are electrically conductively connected to one another; and a second circuit mount including electrical components that are electrically conductively connected to one another, wherein the first circuit mount and the second circuit mount are electrically conductively connected to one another, wherein the second circuit mount is thermally conductively and fixedly connected to a fluid-tight thermally conductive mount element, wherein the first circuit mount has a recess with a through hole extending completely through the first circuit mount, the second circuit mount being arranged in the recess, and wherein the mount element (i) is arranged in the recess, (ii) has a better thermal conductivity than the first circuit mount, (iii) is configured to be thermally conductively connected to a heat sink, and (iv) is laminated into an inner edge region of the first circuit mount in a fluid-tight manner.
地址 Stuttgart DE