Reducing cosmetic surface interference from embedded components

摘要

The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.

主权项

1. A method for embedding a design in a flexible substrate that includes a cosmetic surface having a generally planar configuration, the method comprising:
pressing a carrier form having a feature against the cosmetic surface, wherein pressing the carrier form against the cosmetic surface causes the cosmetic surface to take on a modified configuration by increasing an amount of tension across the cosmetic surface; removing a portion of the flexible substrate from an opposing surface of the flexible substrate; and removing the carrier form from the cosmetic surface, thereby reducing the amount of tension across the cosmetic surface such that the cosmetic surface reverts to the generally planar configuration and the opposing surface takes on the design based on the feature.