发明名称 Printed circuits with sacrificial test structures
摘要 Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.
申请公布号 US9618564(B2) 申请公布日期 2017.04.11
申请号 US201414164769 申请日期 2014.01.27
申请人 Apple Inc. 发明人 Mayo Sean A.;Pennathur Shankar S.
分类号 B05D1/02;B05D1/28;G01R31/28;H05K1/02;H05K1/14 主分类号 B05D1/02
代理机构 Treyz Law Group, P.C. 代理人 Treyz Law Group, P.C. ;Treyz G. Victor;Guihan Joseph F.
主权项 1. Apparatus, comprising: a printed circuit board comprising a plurality of printed circuit layers, wherein the printed circuit board has first and second opposing surfaces connected by an edge and at least two of the printed circuit layers are separated by a gap forming an opening along the edge of the printed circuit board; conductive traces in the printed circuit layers that form printed circuit contacts in the opening; an electrical component mounted directly to the first surface of the printed circuit board, wherein the printed circuit contacts in the opening are coupled to the electrical component by the conductive traces and are configured to mate with contacts on an external structure during testing; and dielectric in the opening that covers the printed circuit contacts in the opening after testing.
地址 Cupertino CA US