Ultra-broadband photonic integrated circuit platform and ultra-broadband photonic integrated circuit

摘要

An ultra-broadband photonic integrated circuit platform that combines at least two types of waveguides that each transmit in different, but overlapping, spectral bands on a single chip. By combining the multiple waveguides, the bandwidth of the platform can be extended beyond the bandwidth of either waveguide alone. In an exemplary embodiment, an ultra-broadband photonic integrated circuit includes a nitride-on-insulator (NOI) waveguide configured to transmit optical beams in a first spectral band and a silicon-on-nitride-on-insulator (SONOI) waveguide configured to transmit optical beams in a second band, where the same material serves as the core material in the NOI waveguide and as the cladding material in the SONOI waveguide. In some embodiments, light-emitting devices are bonded to an upper surface of the waveguides. In some embodiments, the circuit includes beam-combining elements so that a single beam combining all of the input wavelengths is output from the circuit.

主权项

1. An ultra-broadband photonic integrated circuit platform, comprising:
a first waveguide and a second waveguide situated on a single chip, the first waveguide being configured to transmit optical signals having wavelengths in a first spectral band (“Band 1”) and the second waveguide being configured to transmit optical signals having wavelengths in a second spectral band (“Band 2”), the wavelengths in Band 1 overlapping the wavelengths in Band 2; wherein the first and second waveguide each comprise a heterostructure comprising a core layer, a bottom cladding layer and a top cladding layer; wherein the same layer of material forms both a core of the first waveguide and the bottom cladding layer of the second waveguide; and wherein an overall bandwidth of the platform is greater than either Band 1 or Band 2.