发明名称 CONNECTION STRUCTURES FOR PROVIDING A REFERENCE POTENTIAL TO A FLEXIBLE CIRCUIT DEVICE
摘要 Techniques and mechanisms for providing a reference potential with a flexible circuit device. In an embodiment, the flexible circuit device includes a first interconnect to exchange a signal and a second interconnect to exchange a reference potential that facilitates shielding of the signal. The first and second interconnects are variously coupled to a printed circuit board (PCB) via a first contact and a second contact of a hardware interface. During such coupling, a maximum height of the second interconnect from a side of the PCB at the hardware interface is greater than a maximum height of the first interconnect from the side of the PCB at the hardware interface. In another embodiment, a distance of the first contact from an end of the flexible circuit device is different than a distance of the second contact from the end of the flexible circuit device.
申请公布号 US2017093059(A1) 申请公布日期 2017.03.30
申请号 US201514866610 申请日期 2015.09.25
申请人 Chen Kuan-yu;Hsu Hao-han;Li Jingbo;Li Xiang 发明人 Chen Kuan-yu;Hsu Hao-han;Li Jingbo;Li Xiang
分类号 H01R12/59;H05K1/02;H05K1/14;H01R43/20 主分类号 H01R12/59
代理机构 代理人
主权项 1. A flexible circuit device comprising: a flexible substrate having disposed therein a first interconnect and a second interconnect; and a hardware interface configured to couple the flexible substrate to a printed circuit board, the hardware interface including: a first contact coupled to the first interconnect, wherein, while the flexible circuit device is coupled to the printed circuit board, the first contact to exchange a signal between the first interconnect and a third interconnect of the printed circuit board; anda second contact coupled to the second interconnect, wherein, while the flexible circuit device is coupled to the printed circuit board, the second contact to exchange a reference potential between the second interconnect and a fourth interconnect of the printed circuit board;wherein, while the flexible circuit device is coupled to the printed circuit board, a maximum height of the second interconnect from a side of the printed circuit board at the hardware interface is greater than a maximum height of the first interconnect from the side of the printed circuit board at the hardware interface.
地址 Hillsboro OR US