发明名称 Temperature Compensation of Fabricated Semiconductors
摘要 Semiconductor devices and methods are described wherein temperature dependence of leakage current in at least one pathway of a device is compensated by a resistor in the device. Control of temperature dependent leakage current is particularly useful for silicon nitride devices and for circuits such as cascode circuits. A semiconductor leakage current that increases with temperature may be compensated by a fabricated resistor such as a boron doped polysilicon resistor that is electrically connected to compensate the leakage current in the pathway.
申请公布号 US2017092640(A1) 申请公布日期 2017.03.30
申请号 US201514865526 申请日期 2015.09.25
申请人 SANKEN ELECTRIC CO., LTD. 发明人 Aoki Hironori;KANEKO Shuichi
分类号 H01L27/06;H01L49/02;H01L29/20 主分类号 H01L27/06
代理机构 代理人
主权项 1. A fabricated semiconductor having temperature compensated leakage current in at least one pathway, comprising: at least one semiconductor device in a pathway having a leakage current that increases with temperature; and a fabricated resistor electrically connected to the at least one semiconductor device, the fabricated resistor fabricated so as to have a temperature coefficient of resistance that causes a current flow in the fabricated resistor that is equal and opposite to that of the at least one semiconductor device to compensate the leakage current in the pathway.
地址 Niiza-shi JP