发明名称 |
Temperature Compensation of Fabricated Semiconductors |
摘要 |
Semiconductor devices and methods are described wherein temperature dependence of leakage current in at least one pathway of a device is compensated by a resistor in the device. Control of temperature dependent leakage current is particularly useful for silicon nitride devices and for circuits such as cascode circuits. A semiconductor leakage current that increases with temperature may be compensated by a fabricated resistor such as a boron doped polysilicon resistor that is electrically connected to compensate the leakage current in the pathway. |
申请公布号 |
US2017092640(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
US201514865526 |
申请日期 |
2015.09.25 |
申请人 |
SANKEN ELECTRIC CO., LTD. |
发明人 |
Aoki Hironori;KANEKO Shuichi |
分类号 |
H01L27/06;H01L49/02;H01L29/20 |
主分类号 |
H01L27/06 |
代理机构 |
|
代理人 |
|
主权项 |
1. A fabricated semiconductor having temperature compensated leakage current in at least one pathway, comprising:
at least one semiconductor device in a pathway having a leakage current that increases with temperature; and a fabricated resistor electrically connected to the at least one semiconductor device, the fabricated resistor fabricated so as to have a temperature coefficient of resistance that causes a current flow in the fabricated resistor that is equal and opposite to that of the at least one semiconductor device to compensate the leakage current in the pathway. |
地址 |
Niiza-shi JP |