发明名称 PRINTED CIRCUIT BOARD WITH EMBEDDED HEATER
摘要 Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.
申请公布号 EP2835030(B9) 申请公布日期 2017.03.15
申请号 EP20130736269 申请日期 2013.01.11
申请人 VIASYSTEMS TECHNOLOGIES CORP., L.L.C. 发明人 WHITE, Gil
分类号 H05B1/00 主分类号 H05B1/00
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