发明名称 |
PRINTED CIRCUIT BOARD WITH EMBEDDED HEATER |
摘要 |
Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components. |
申请公布号 |
EP2835030(B9) |
申请公布日期 |
2017.03.15 |
申请号 |
EP20130736269 |
申请日期 |
2013.01.11 |
申请人 |
VIASYSTEMS TECHNOLOGIES CORP., L.L.C. |
发明人 |
WHITE, Gil |
分类号 |
H05B1/00 |
主分类号 |
H05B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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