发明名称 |
Semiconductor structure and method of manufacturing the same |
摘要 |
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes: a substrate comprising a recess portion filled with a conductive material; a conductive trace overlying and contacting the conductive material; a conductive pillar disposed on the conductive trace and over the recess portion of the substrate; and a semiconductor chip disposed on the conductive pillar, wherein the conductive trace comprises a width WT and a thickness TT, the recess portion of the substrate comprises a width WR in the width direction of the conductive trace and a depth DR, and the ratio of WR to WT ranges from about 0.25 to about 1.8 and the ratio of DR to TT ranges from about 0.1 to about 3. |
申请公布号 |
US9589924(B2) |
申请公布日期 |
2017.03.07 |
申请号 |
US201414471412 |
申请日期 |
2014.08.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
Wu Jiun Yi;Liang Yu-Min |
分类号 |
H01L23/498;H01L23/00 |
主分类号 |
H01L23/498 |
代理机构 |
WPAT, P.C., Intellectual Property Attorneys |
代理人 |
WPAT, P.C., Intellectual Property Attorneys ;King Anthony |
主权项 |
1. A semiconductor structure, comprising:
a substrate comprising a recess portion filled with a conductive material; a conductive trace overlying and contacting the conductive material; a conductive pillar disposed on the conductive trace and over the recess portion of the substrate; and a semiconductor chip disposed on the conductive pillar, wherein the conductive trace comprises a width WT and a thickness TT, the recess portion of the substrate comprises a width WR in the width direction of the conductive trace and a depth DR, and the ratio of WR to WT ranges from about 0.25 to about 1.8 and the ratio of DR to TT ranges from about 0.1 to about 3. |
地址 |
Hsinchu TW |