发明名称 Semiconductor structure and method of manufacturing the same
摘要 A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes: a substrate comprising a recess portion filled with a conductive material; a conductive trace overlying and contacting the conductive material; a conductive pillar disposed on the conductive trace and over the recess portion of the substrate; and a semiconductor chip disposed on the conductive pillar, wherein the conductive trace comprises a width WT and a thickness TT, the recess portion of the substrate comprises a width WR in the width direction of the conductive trace and a depth DR, and the ratio of WR to WT ranges from about 0.25 to about 1.8 and the ratio of DR to TT ranges from about 0.1 to about 3.
申请公布号 US9589924(B2) 申请公布日期 2017.03.07
申请号 US201414471412 申请日期 2014.08.28
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. 发明人 Wu Jiun Yi;Liang Yu-Min
分类号 H01L23/498;H01L23/00 主分类号 H01L23/498
代理机构 WPAT, P.C., Intellectual Property Attorneys 代理人 WPAT, P.C., Intellectual Property Attorneys ;King Anthony
主权项 1. A semiconductor structure, comprising: a substrate comprising a recess portion filled with a conductive material; a conductive trace overlying and contacting the conductive material; a conductive pillar disposed on the conductive trace and over the recess portion of the substrate; and a semiconductor chip disposed on the conductive pillar, wherein the conductive trace comprises a width WT and a thickness TT, the recess portion of the substrate comprises a width WR in the width direction of the conductive trace and a depth DR, and the ratio of WR to WT ranges from about 0.25 to about 1.8 and the ratio of DR to TT ranges from about 0.1 to about 3.
地址 Hsinchu TW