发明名称 CONDUCTOR CONNECTING STRUCTURE AND MOUNTING BOARD
摘要 A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material including a first surface, a second surface, and an end surface. The mounting board also includes a first conductor layer and a second conductor layer. The target board includes a mounting surface and a third conductor layer formed on the mounting surface. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate to connect an end portion of the first or second conductor layer to the third conductor layer. One of the end portions not subjected to connection established with the anisotropic conductive material is separated further from the end surface of the base material than another end portion which is connected to the third conductor layer.
申请公布号 US2017064829(A1) 申请公布日期 2017.03.02
申请号 US201615207721 申请日期 2016.07.12
申请人 FUJI XEROX CO., LTD. 发明人 OHTSU Shigemi
分类号 H05K1/14;H05K1/11;H05K1/09;H05K1/02;H01R4/02;H01R12/52 主分类号 H05K1/14
代理机构 代理人
主权项 1. A conductor connecting structure comprising: a mounting board that includes a base material that is formed of an insulating material and that includes a first surface,a second surface, andan end surface,a first conductor layer that is formed on the first surface and that has an end portion, anda second conductor layer that is formed on the second surface and that has an end portion; and a target board that includes a mounting surface on which the mounting board is mounted, anda third conductor layer formed on the mounting surface; and an anisotropic conductive material that includes a polymeric material, andelectrically conductive particles that are dispersed in the polymeric material and that, when the electrically conductive particles are heated, aggregate so as to connect the end portion of the first conductor layer or the end portion of the second conductor layer and the third conductor layer to each other, wherein, in the mounting board, one end portion not subjected to connection established with the anisotropic conductive material out of the end portion of the first conductor layer and the end portion of the second conductor layer is separated further from the end surface of the base material than another end portion connected to the third conductor layer out of the end portion of the first conductor layer and the end portion of the second conductor layer.
地址 Tokyo JP
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