| 摘要 |
In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an Al-Si-based brazing filler material. The Al-Si-based brazing filler material has a melting point in a range of approximately 600°C to 700°C. When the heat sink (23) and the ceramic substrate (11) are joined together using the Al-Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time. |
