| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element manufacturing method, a semiconductor element with an adhesive layer and a semiconductor device, which can ensure thickness uniformity of the adhesive layer.SOLUTION: In the present semiconductor element manufacturing method, formation of an adhesive layer 3 through semi-curing to attachment of a dicing tape 6 are performed on the same susceptor P. By doing this, the semi-curing can be performed with thickness uniformity being favorably maintained when an adhesive composition is coated, and a sufficient adhesive strength of the adhesive layer 3 can be ensured. Further, by performing lamination of the dicing tape 6 on the same susceptor, transfer and the like of a semiconductor wafer 1 can be performed in the subsequent processes in a state where the dicing tape 6 is laminated thereby to enable prevention of damages and contamination of the semiconductor wafer 1. These achieve improvement in reliability in a semiconductor device 15 manufactured by using the manufacturing method. |
