| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal treatment apparatus which cools a heating plate more efficiently, and to provide a heating plate cooling method.SOLUTION: A thermal treatment apparatus 1 includes: a heating plate 11 which heats a substrate W; a passive cooling plate 17 for receiving heat from the heating plate 11; an active cooling part 13 which is disposed at a position separated from the heating plate 11 and is used for receiving the heat from the passive cooling plate 17; a driving mechanism 18 which moves the heating plate 11 and the passive cooling plate 17 relate to each other for thermally connecting the heating plate 11 with the passive cooling plate 17 and moves the passive cooling plate 17 and the active cooling part 13 relative to each other for thermally connecting the passive cooling plate 17 with the active cooling part 13; and a heat conductive sheet 15 which closely contacts with both of the active cooling part 13 and the passive cooling plate 17 and thermally connects the active cooling part 13 with the passive cooling plate 17. |
