发明名称 PRINTED WIRING BOARD AND ELECTRONIC COMPONENT
摘要 This printed wiring board comprises: a base film having polyimide as the main component thereof; and a conductive pattern laminated on at least one surface of this base film. The conductive pattern includes a copper particle bonding layer that adheres to the base film. The external transmittance for a 500 nm wavelength in an area on the base film in which the conductive pattern is not laminated is no more than 70% of the internal transmittance for a 500 nm wavelength in a center layer section of the base film.
申请公布号 WO2017029972(A1) 申请公布日期 2017.02.23
申请号 WO2016JP72504 申请日期 2016.08.01
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. 发明人 OKAMOTO, Kohei;MIURA, Kousuke;UEDA, Hiroshi;KASUGA, Takashi;MIYATA, Kazuhiro
分类号 H05K1/03;H05K3/00 主分类号 H05K1/03
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