This printed wiring board comprises: a base film having polyimide as the main component thereof; and a conductive pattern laminated on at least one surface of this base film. The conductive pattern includes a copper particle bonding layer that adheres to the base film. The external transmittance for a 500 nm wavelength in an area on the base film in which the conductive pattern is not laminated is no more than 70% of the internal transmittance for a 500 nm wavelength in a center layer section of the base film.
申请公布号
WO2017029972(A1)
申请公布日期
2017.02.23
申请号
WO2016JP72504
申请日期
2016.08.01
申请人
SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.