| 发明名称 | Positive microcontact printing | ||
| 摘要 | A process for positive microcontact printing, including inking a patterned mold with a thiol; contacting the mold with a metal surface of a substrate; backfilling the metal surface with a solution containing an aromatic amine to form a backfilling layer; etching the metal surface of the substrate; and rinsing the substrate to remove the backfilling layer. | ||
| 申请公布号 | US9575226(B2) | 申请公布日期 | 2017.02.21 |
| 申请号 | US201414492449 | 申请日期 | 2014.09.22 |
| 申请人 | THE CHINESE UNIVERSITY OF HONG KONG | 发明人 | Chen Shih-Chi;Zhao Ni;Xu Huihua;Zhou Xi |
| 分类号 | C03C15/00;G02B5/18;C23F1/00;H05K1/02;B81C1/00;C23F1/44;C23C22/02;C23F1/02;C23F1/14;H05K3/06;H05K1/11 | 主分类号 | C03C15/00 |
| 代理机构 | Knobbe Martens Olson & Bear LLP | 代理人 | Knobbe Martens Olson & Bear LLP |
| 主权项 | 1. A process for positive microcontact printing, comprising inking a patterned mold with a thiol; contacting the mold with a metal surface of a substrate; backfilling the metal surface with a solution containing an aromatic amine to form a backfilling layer; etching the metal surface covered by the thiol; and rinsing the substrate to remove the backfilling layer. | ||
| 地址 | Hong Kong CN | ||