WAFER SUPPORT STRUCTURE

摘要

A wafer support structure 10 includes a ceramic tray plate 12 having a plurality of wafer placement portions 14 in which wafers W are placed, and arranged on an upper surface of a ceramic base plate 20. The base plate 20 incorporates a base-side electrode 22, and the tray plate 12 incorporates a tray-side electrode 18. In the wafer support structure 10, voltages applied to the base-side electrode 22 and the tray-side electrode 18 are adjusted in a state where the wafers W are placed in the wafer placement portions 14. As a result, an electrostatic force acting to attract the base plate 20 and the tray plate 12 to each other is generated, and an electrostatic force acting to attract the tray plate 12 and the wafers W to each other is generated.

主权项

1. A wafer support structure including a ceramic tray plate having a plurality of wafer placement portions in which wafers are placed, and arranged on an upper surface of a ceramic base plate,
wherein the base plate incorporates a base-side electrode, the tray plate incorporates a tray-side electrode, and an electrostatic force acting to attract the base plate and the tray plate to each other is generated and an electrostatic force acting to attract the tray plate and the wafers to each other is generated by adjusting voltages applied to the base-side electrode and the tray-side electrode in a state where the wafers are placed in the wafer placement portions.