SEMICONDUCTOR DEVICE

摘要

In a semiconductor device, a multilayer substrate includes an insulating substrate, a first circuit board having a first semiconductor chip disposed thereon, and a second circuit board having a second semiconductor chip disposed thereon. On the multilayer substrate of the semiconductor device, a plate portion of a resin plate including a first positioning portion that regulates the position of each semiconductor chip is sandwiched between a first jumper terminal, which includes a first terminal connected to the first semiconductor chip and a first plate member perpendicular to the first terminal, and a second jumper terminal, which includes a second terminal connected to the second semiconductor chip and a second plate member perpendicular to the second terminal.

主权项

1. A semiconductor device comprising:
a multilayer substrate including an insulating substrate, a first circuit board disposed on a front surface of the insulating substrate, and a second circuit board disposed on the front surface in parallel with the first circuit board; a first semiconductor chip disposed on the first circuit board; a second semiconductor chip disposed on the second circuit board; a first jumper terminal including
a first terminal portion electrically connected to a main electrode of the first semiconductor chip, anda first plate member; a second jumper terminal including
a second terminal portion electrically connected to a main electrode of the second semiconductor chip, anda second plate member; and a resin plate including
a first positioning portion placed on a front surface of the first circuit board and regulating a position of the first semiconductor chip with respect to the first circuit board,a second positioning portion placed on a front surface of the second circuit board and regulating a position of the second semiconductor chip with respect to the second circuit board, anda plate portion that is sandwiched between the first plate member and the second plate member at a position between the first circuit board and the second circuit board.