Shaped and oriented solder joints

摘要

The present description relates to the field of fabricating microelectronic assemblies, wherein a microelectronic device may be attached to a microelectronic substrate with a plurality of shaped and oriented solder joints. The shaped and oriented solder joints may be substantially oval, wherein the major axis of the substantially oval solder joints may be substantially oriented toward a neutral point or center of the microelectronic device. Embodiments of the shaped and oriented solder joint may reduce the potential of solder joint failure due to stresses, such as from thermal expansion stresses between the microelectronic device and the microelectronic substrate.

主权项

1. An apparatus, comprising:
a microelectronic device; a microelectronic substrate; and a plurality of interconnects connecting the microelectronic device and the microelectronic structure, wherein the plurality of interconnects includes a plurality of substantially oval solder bumps which are substantially radially oriented by a major axis thereof toward a neutral point of the microelectronic device, wherein the plurality of interconnects includes a plurality conductive pillars and wherein the substantially oval solder bumps are disposed on the plurality of conductive pillars; wherein the microelectronic substrate includes a plurality of line traces, wherein at least a portion of each microelectronic substrate line trace is substantially radially oriented toward the microelectronic device neutral point and wherein the substantially oval solder bumps are attached to the microelectronic substrate line trace portions.