| 摘要 |
A cooling promoting structure (10) in which a first flow path walls (11) includes a first collision surface (11a) which collides with cooling gas (X) flowing through a first flow path (12), a second flow path walls (13) includes a second collision surface (13a) which collides with the cooling gas (X) flowing through a second flow path (14), and the first flow path (12) and the second flow path (14) are connected to each other via inflow openings (15a) at a location where the first collision surface (11a) and the second collision surface (13a) are disposed. |
