| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming device capable of economically saving a process liquid for film formation while maintaining uniformity of a film thickness, a film forming method, and a recording medium.SOLUTION: A coating unit U1 includes: a support 20 for a wafer W; a lid 40 having a counter surface 41 opposing to the whole surface region of the wafer, with the counter surface 41 subjected to a water repellency treatment; an elevation unit 30 that elevates and descends the lid 40; a supply tank 61 of a resist agent; a supply hole 42 disposed in the lid 40 and opening at the center of the counter surface 41; an extrusion pump 50 disposed between the supply tank 61 and the supply hole 42; and a control unit 100. The control unit 100 performs a control on the extrusion pump 50 to supply the resist agent between the lid 40 and the wafer, a control on the extrusion pump 50 to stop spreading of the resist agent between the lid 40 and the wafer up close to a peripheral edge of the wafer, and a control on the elevating unit 30 to part the lid 40 away from the wafer after spreading of the resist agent is stopped. |
