SUCTION APPARATUS, CARRY-IN METHOD, CONVEYANCE SYSTEM, LIGHT EXPOSURE DEVICE, AND DEVICE PRODUCTION METHOD

摘要

In a carrier system, a chuck unit (153) is used to hold a placed wafer (W) from above, and vertical-motion pins (140) use suction to hold the wafer (W) from below. Then, chuck unit (153) and vertical-motion pins (140) are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table (WTB). During the lowering, the holding force exerted by chuck unit (153) and the arrangement of chuck members (124) are optimally adjusted such that, as a result of the restraint of wafer (W) by chuck unit (153) and vertical-motion pins (140), localized surplus-restraint is imparted to wafer (W), and warping does not occur.