| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of preventing an insulating film from being separated from a lead frame.SOLUTION: A semiconductor device 10 comprises: a first semiconductor chip 31 and a second semiconductor chip 32 that are disposed adjacent to each other; a first lead frame 21 disposed on the first semiconductor chip 31; and a second lead frame 22 disposed on the second semiconductor chip 32. The semiconductor device 10 comprises: a first insulating film 11 coating a side surface of the first lead frame 21; a second insulating film 12 coating a side surface of the second lead frame 22; a first coating film 13 coating the first insulating film 11; a second coating film 14 coating the second coating film 12; and a sealing resin 40 that seals the first semiconductor chip 31 and the second semiconductor chip 32 and are filled between the first lead frame 21 and the second lead frame 22 and that adheres to the first coating film 13 and the second coating film 14 which face each other. |
