| 摘要 |
The invention relates to a testing device (6) for a discrete semiconductor component (1). The invention further relates to a method for testing a discrete semiconductor component (1). In order to simplify and improve the performance of tests of semiconductor components (1) in temperate environments, according to the invention a contact surface (14) of a heating element (8) of a thermal attachment (7) that can be placed on a test base (2) is placed, in a planar manner, against a semiconductor component (1) accommodated in the test base (2). |
