发明名称 HYBRID INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To provide the title integrated circuit capable of leading independent test point out of the whole pin in the SCIC without making preparation of specific connecting parts or exclusive test point such as the chip part for jumper, etc., in consideration of the deterioration in the yield and integration degree resultant from the multifunctional high integration of SCIC and the conversion into multiple pins due to the conversion into ASIC. CONSTITUTION:The test pin pads 2a, 2b, 2c led out of the pins of an SCIC are adjacently arranged to form a terminal pad 4 and then independent test point is led out to judge and inspect the acceptability of the SCIC packaged by connecting inspection circuits. Furthermore, the specific network circuits can be constituted by soldering a terminal 3 onto the terminal pad 4.
申请公布号 JPH0637235(A) 申请公布日期 1994.02.10
申请号 JP19920191831 申请日期 1992.07.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IWATA MASAO
分类号 H01L23/50 主分类号 H01L23/50
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