3D packages and methods for forming the same

摘要

Embodiments of the present disclosure include a semiconductor device, a package and methods of forming a semiconductor device and a package. An embodiment is a semiconductor device including a molding material over a first substrate with a first opening having a first width in the molding material. The semiconductor device further includes a second opening having a second width in the molding material with the second width being greater than the first width. A first connector is in the first opening and a second connector is in the second opening.

主权项

1. A method of forming a semiconductor device, the method comprising:
molding a molding material over a first substrate, the first substrate comprising a first edge region, a middle region next to the first edge region, and a second edge region next to the middle region and opposite the first edge region; forming a first opening in the molding material in the first edge region, the first opening having a first width; forming a first connector in the first opening; forming a second opening in the molding material in the middle region, the second opening having a second width, the second width being greater than the first width; forming a second connector in the second opening; forming a third opening in the in the molding material in the second edge region, the third opening having a third width, the third width being greater than the second width; forming a third connector in the third opening; and bonding a second package to the first connector, the second connector, and the third connector, a first surface of the second package being physically separated from a first surface of the molding material by a first gap in the first edge region, a second gap in the middle region, and a third gap in the second edge region, the first gap being greater than the second gap, and the second gap being greater than the third gap.