发明名称 |
Method for Integrated Circuit Manufacturing |
摘要 |
A method of manufacturing an integrated circuit (IC) includes: receiving a target layout of the IC, decomposing the target layout into a plurality of sub-layouts for a multiple patterning process, identifying re-locatable pattern edges in the sub-layouts, and relocating the edges to improve manufacturability of the IC. In an embodiment, relocating the edges includes: choosing an evaluation index based on a target manufacturing process, moving one or more of the edges, calculating a score of manufacturability based on the evaluation index, and repeating the moving and the calculating until the score meets a threshold. |
申请公布号 |
US2017004242(A1) |
申请公布日期 |
2017.01.05 |
申请号 |
US201514754769 |
申请日期 |
2015.06.30 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chang Shih-Ming;Lee Chien-Fu;Tseng Chin-Yuan |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
receiving a target layout of an integrated circuit (IC); decomposing the target layout into a plurality of sub-layouts for a multiple patterning process, wherein the sub-layouts include a plurality of pattern edges, each of which is re-locatable within a respective region of freedom; relocating the pattern edges to improve manufacturability of the IC, resulting in modified sub-layouts; and storing the modified sub-layouts in a tangible computer-readable medium for use by a further IC process stage. |
地址 |
Hsin-Chu TW |