发明名称 |
THREE-DIMENSIONAL MOUNTING METHOD AND THREE-DIMENSIONAL MOUNTING DEVICE |
摘要 |
A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper face alignment position of the N-th uppermost-layer joining material. |
申请公布号 |
US2017005068(A1) |
申请公布日期 |
2017.01.05 |
申请号 |
US201415038963 |
申请日期 |
2014.11.19 |
申请人 |
TORAY ENGINEERING CO., LTD. |
发明人 |
NISHIMURA Koji;TERADA Katsumi;KAWAKAMI Mikio |
分类号 |
H01L23/00;H01L25/00;H01L25/065 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A three-dimensional mounting method in which N number of upper-layer joining materials with electrodes on upper and lower faces are successively laminated onto a lowermost-layer joining material with an electrode such that positions of the electrodes of the upper-layer joining materials and a position of the electrode of the lowermost-layer joining material are arranged in an aligned state, the three-dimensional mounting method comprising:
when laminating a first upper-layer joining material over the lowermost-layer joining material, positioning the first upper-layer joining material relative to the lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position marked on a lower face of the first upper-layer joining material by a two-field image recognition unit, and storing positional coordinates of the alignment position of the lowermost-layer joining material; when joining an (n+1)-th upper-layer joining material over an n-th upper-layer joining material, where 1≦n≦N−1, positioning the (n+1)-th upper-layer joining material relative to the n-th upper-layer joining material by recognizing an upper face alignment position marked on an upper face of the n-th upper-layer joining material and a lower face alignment position marked on a lower face of the (n+1)-th upper-layer joining material by the two-field image recognition unit, and storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material; and after laminating an N-th uppermost-layer joining material, recognizing an upper face alignment position marked on an upper face of the N-th uppermost-layer joining material, and storing positional coordinates of the upper face alignment position of the N-th uppermost-layer joining material. |
地址 |
Tokyo JP |