Semiconductor light emitting diode package and lighting device using the same

摘要

A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and second electrode structures using a wire. The LED chip includes a light emitting structure and first and second electrode parts. At least one of the first and second electrode parts includes a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire, and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole filled with the wire. The at least one through hole allows a top surface of the bonding electrode layer to be exposed therebelow.

主权项

1. A semiconductor light emitting diode (LED) package comprising:
a package body having first and second electrode structures; and an LED chip bonded to at least one of the first and second electrode structures of the package body using a wire, wherein the LED chip comprises: a light emitting structure including a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer sequentially stacked therein; a first electrode part electrically connecting the first conductivity type semiconductor layer to the first electrode structure; and a second electrode part electrically connecting the second conductivity type semiconductor layer to the second electrode structure, wherein at least one of the first and second electrode parts comprises: a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire; and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole formed therein, the at least one through hole being filled with a part of the wire and allowing a top surface of the bonding electrode layer to be exposed therebelow.