发明名称 セラミック電子部品の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic electronic component capable of combining suppression of blister (floating phenomenon of an electrode film) of an external electrode and densification.SOLUTION: A method of manufacturing a multilayer capacitor 1 includes a step for forming a ceramic body 10 containing an oxide of Ca having a pair of principal surfaces 10a, 10b facing each other, a pair of side faces facing each other and a pair of end faces 10e, 10f facing each other, a step for coating both ends of the ceramic body 10 with a conductive paste for an external electrode containing a Cu powder and glass having viscosity satisfying a relation log&eegr;<2 Pa s at temperatures of 820°C-870°C, and a baking step for baking the conductive paste for an external electrode in an inert gas at a baking temperature equal to or higher than the temperature when the viscosity of glass is log&eegr;=2 Pa s or less but equal to or lower than 870°C.
申请公布号 JP6015221(B2) 申请公布日期 2016.10.26
申请号 JP20120175276 申请日期 2012.08.07
申请人 株式会社村田製作所 发明人 原田 敏宏;松野 悟;草野 満洋;福田 吉宏
分类号 H01G4/12;H01G4/232;H01G4/30 主分类号 H01G4/12
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