| 摘要 |
PROBLEM TO BE SOLVED: To remove a removal target layer well together with a cured film formed on the surface thereof, without causing any damage on the ground layer of a substrate, when removing the removal target layer formed on the ground layer on the substrate surface with a mixture of sulphuric acid and hydrogen peroxide water.SOLUTION: A substrate processing method of a substrate processing device (1) for removing a removal target layer by supplying a mixture of sulphuric acid and hydrogen peroxide water to a substrate (3) where the removal target layer is formed on the surface of a ground layer includes the steps of: supplying the mixture to the substrate (3) under first conditions; and supplying the mixture to the substrate (3) under second conditions. The second conditions are the conditions of not causing any damage on the ground layer, and the first conditions are the conditions of having a higher ability to remove the removal target layer than that in the second conditions. |
