| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of joining projecting terminals together at a low temperature and with a low load, and to provide a method for manufacturing the same.SOLUTION: A method for manufacturing a semiconductor device comprises: arranging a first substrate having first projecting electrodes in which at least a peripheral part of a top face of each projecting electrode is formed by a metal film composed of microcrystal or amorphous and a second substrate having second projecting electrodes so as to face the first projecting electrodes and the second projecting electrodes; performing a heat treatment while applying pressure between the first substrate and the second substrate to bring the first projecting electrodes into tight contact with the second projecting electrodes; and recrystallizing the metal film to join the first projecting electrodes and the second projecting electrodes by means of recrystallized metal film. |
