| 摘要 |
PROBLEM TO BE SOLVED: To provide an interlayer filler composition for a three-dimensional integrated circuit, with which an interlayer filled layer with high thermal conductivity can be formed, a homogeneous coating film excellent in surface smoothness can be formed based on an excellent coating property, and with which an excellent interlayer filled layer can be formed by heating and curing via B-stage formation.SOLUTION: An interlayer filler composition for a three-dimensional integrated circuit contains: an epoxy resin (A) with thermal conductivity of ≥0.2 W/mK, melt viscosity at 50°C of ≥2,000 Pa s, and melt viscosity at 120°C of ≤100 Pa s; an inorganic filler (B) with thermal conductivity of ≥2 W/mK, an average particle diameter of ≥0.1 μm and ≤5 μm, and a maximum particle diameter of ≤10 μm, a curing agent (C) and/or a flux (D); and a dispersant (E) with an amine value (mg-KOH/g) of ≥10 and ≤300. In addition, a coating liquid of the interlayer filler composition for a three-dimensional integrated circuit contains an organic solvent (F). |
