发明名称 INTEGRATION OF III-V DEVICES ON SI WAFERS
摘要 An insulating layer is conformally deposited on a plurality of mesa structures in a trench on a substrate. The insulating layer fills a space outside the mesa structures. A nucleation layer is deposited on the mesa structures. A III-V material layer is deposited on the nucleation layer. The III-V material layer is laterally grown over the insulating layer.
申请公布号 EP3050077(A1) 申请公布日期 2016.08.03
申请号 EP20130894184 申请日期 2013.09.27
申请人 INTEL CORPORATION 发明人 DASGUPTA, SANSAPTAK;THEN, HAN WUI;SUNG, SEUNG HOON;GARDNER, SANAZ K.;RADOSAVLJEVIC, MARKO;CHU-KUNG, BENJAMIN;CHAU, ROBERT S.
分类号 H01L21/20 主分类号 H01L21/20
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