| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting diode device which can inhibit an increase in manufacturing cost and improve light extraction efficiency by emitting uniform white light while preventing a decrease in light emission efficiency of an optical semiconductor layer; and provide a light emitting diode element used for the manufacturing method.SOLUTION: A light emitting diode device manufacturing method comprises the steps of: forming a fluorescent layer 17 on a top face of a sheet-like mold release base material 18 in a sheet shape; forming an electrode part 4 on a top face of an optical semiconductor layer 3; forming the optical semiconductor layer 3 on a top face of the fluorescent layer 17; forming an encapsulation resin layer 14 containing a light reflection component on the fluorescent layer 17 so as to cover the optical semiconductor layer 3 and the electrode part 4; removing a part of the encapsulation resin layer 14 so as to expose a top face of the electrode part 3 to manufacture a light emitting diode element 20; and flip-chip packaging the light emitting diode element 20 to a base substrate 16 by arranging the light emitting diode element 20 in an opposed manner to the base substrate 16 in a thickness direction and electrically connecting the electrode part 4 and terminals 15. |
