发明名称 SOLDERING APPARATUS FOR CAMERA MODULE
摘要 The present invention relates to a soldering apparatus for a camera module and, more specifically, relates to a soldering apparatus for a camera module comprising a means to control a pressure applied to the camera module during a soldering process. According to the present invention, the soldering apparatus for the camera module comprises: a soldering unit; an X-axis driving unit; a stage unit; and a tension control means.
申请公布号 KR20160086776(A) 申请公布日期 2016.07.20
申请号 KR20160062987 申请日期 2016.05.23
申请人 TOP ENGINEERING CO., LTD.;POWER LOGICS CO., LTD. 发明人 KIM, JI HONG;CHEON, GI IN;HAN, JIN HYUN;KANG, BYUNG HWAN;BAE, CHULL OH
分类号 B23K1/00;B23K3/02;B23K37/04;B23K101/36;G03B17/02 主分类号 B23K1/00
代理机构 代理人
主权项
地址