发明名称 |
SOLDERING APPARATUS FOR CAMERA MODULE |
摘要 |
The present invention relates to a soldering apparatus for a camera module and, more specifically, relates to a soldering apparatus for a camera module comprising a means to control a pressure applied to the camera module during a soldering process. According to the present invention, the soldering apparatus for the camera module comprises: a soldering unit; an X-axis driving unit; a stage unit; and a tension control means. |
申请公布号 |
KR20160086776(A) |
申请公布日期 |
2016.07.20 |
申请号 |
KR20160062987 |
申请日期 |
2016.05.23 |
申请人 |
TOP ENGINEERING CO., LTD.;POWER LOGICS CO., LTD. |
发明人 |
KIM, JI HONG;CHEON, GI IN;HAN, JIN HYUN;KANG, BYUNG HWAN;BAE, CHULL OH |
分类号 |
B23K1/00;B23K3/02;B23K37/04;B23K101/36;G03B17/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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