ELASTIC WAVE DEVICE AND MANUFACTURING METHOD FOR SAME

摘要

In an elastic wave device, IDT electrodes on a piezoelectric substrate are electrically connected to wiring electrodes. A support member covers at least portions of the wiring electrodes. Through-holes in the support member expose upper surfaces of the wiring electrodes and have conductive layers filled therein. The wiring electrodes each have a multilayer structure in which a refractory metal film having a melting point of 900° C. or higher, a diffusion preventive film, and an Al or Al-alloy film are laminated successively from the upper surface side.

主权项

1. An elastic wave device comprising:
a piezoelectric substrate; IDT electrodes on the piezoelectric substrate; wiring electrodes electrically connected to the IDT electrodes and covering portions of the IDT electrodes; an insulating member on the piezoelectric substrate, covering at least portions of the wiring electrodes, and including through-holes at which upper surfaces of the wiring electrodes are exposed; and conductive layers filled in the through-holes of the insulating member; wherein each of the wiring electrodes has a multilayer structure in which a refractory metal layer having a melting point of 900° C. or higher, a diffusion preventive film, and an Al or Al-alloy film are laminated successively from an upper surface side.