发明名称 SUBSTRATE CLEANING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CLEANING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate cleaning device which removes fine particles from a substrate, such as a wafer, without using a chemical solution.SOLUTION: A substrate cleaning device includes: a substrate support part 1 configured to support a substrate W; a vibrator 5 attached to the substrate support part 1; a vibration controller 8 which causes the vibrator 5 to vibrate at a natural frequency of the substrate W; and a cleaning fluid supply nozzle 10 which supplies a cleaning fluid to the substrate W.SELECTED DRAWING: Figure 2
申请公布号 JP2016100368(A) 申请公布日期 2016.05.30
申请号 JP20140234007 申请日期 2014.11.18
申请人 EBARA CORP 发明人 SHINOZAKI HIROYUKI
分类号 H01L21/304 主分类号 H01L21/304
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