| 摘要 |
Embodiments relate to a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a dielectric layer (130) under a second conductivity type semiconductor layer (106), the dielectric layer exposing at least one bottom portion of the second conductivity type semiconductor laye, and a second electrode layer (120) being directly in contact with the at least one bottom portion of the second conductivity type semiconductor layer exposed by the dielectric layer. |
