发明名称 |
BLANKING SYSTEM FOR MULTI CHARGED PARTICLE BEAMS, AND MULTI CHARGED PARTICLE BEAM WRITING APPARATUS |
摘要 |
A blanking system for multi charged particle beams includes a blanking aperture array device to include a first substrate where a plurality of openings corresponding to passage positions of multi-beams are formed in a penetrating manner from the upper surface, and a plurality of electrode groups each having a pair of electrodes which are close to a corresponding one of the plurality of openings and are at opposite sides, on a same surface, of the corresponding one of the plurality of openings are arranged on the first substrate, a second substrate whose lower surface is electrically connected through a bump to the upper surface of the first substrate, and a mounting substrate whose upper surface is electrically connected through a bump to the lower surface of the second substrate. |
申请公布号 |
US2016141142(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
US201514879447 |
申请日期 |
2015.10.09 |
申请人 |
NuFlare Technology, Inc. |
发明人 |
MATSUMOTO Hiroshi |
分类号 |
H01J37/04;H01J37/20;H01J37/317 |
主分类号 |
H01J37/04 |
代理机构 |
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代理人 |
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主权项 |
1. A blanking system for multi charged particle beams comprising:
a blanking aperture array device configured to include a first substrate where a plurality of openings corresponding to passage positions of multi-beams are formed in a penetrating manner from an upper surface, and a plurality of electrode groups each having a pair of electrodes which are close to a corresponding one of the plurality of openings and are at opposite sides, on a same surface, of the corresponding one of the plurality of openings are arranged on the first substrate; a second substrate whose lower surface is electrically connected through a bump to an upper surface of the first substrate; and a mounting substrate whose upper surface is electrically connected through a bump to a lower surface of the second substrate. |
地址 |
Yokohama JP |