PHOTOSENSITIVE ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition that has comparable photosensitive characteristics (sensitivity and resolution) to those of a photosensitive resin composition used for a buffer coat layer, and that also has dry-etching durability, thermo-compression bonding property, and reflow durability after moisture absorption.SOLUTION: The photosensitive adhesive composition comprises the following components: (A) a phenolic resin; (B) a compound that generates an acid by light; (C) a thermal crosslinking agent; and (D) an acrylic resin containing a specific structural unit, the acrylic resin containing a structural unit having an amino group by 0 to 3 mol%.SELECTED DRAWING: Figure 1