| 摘要 |
PROBLEM TO BE SOLVED: To improve the quality of a semiconductor device manufactured by a die bonder by effectively suppressing bonding of a damaged semiconductor die in the die bonder.SOLUTION: A die bonder 100 includes: a rear face camera 30 for capturing an entire image including an adsorption face image of a collet 20 which adsorbs a semiconductor die 40, and an image of the semiconductor de 40 adsorbed by the collet 20; and an image processing part 80 for processing images which are captured by the rear face camera 30. The image processing part 80 includes: image region definition means for defining an image region of the semiconductor die 40 in the entire image on the basis of a lightness difference between the adsorption face image of the collet 20 and the image of the semiconductor die 40 and a reference image of the semiconductor die 40; and damage detection means which scans the inside of the image region of the semiconductor die defined by the image region definition means and discriminates the damage of the semiconductor die when a change ratio of lightness in a scan direction is equal to or more than a predetermined threshold.SELECTED DRAWING: Figure 1 |
