发明名称 実装基板および発光装置
摘要 External connection conductors are arranged on a back surface of a base material, and wiring conductors are arranged on a front surface. An insulating layer is provided on surfaces of the wiring conductors. Component mounting conductors are provided on a surface of the insulating layer. The component mounting conductor and the wiring conductor are electrically coupled to each other, and the component mounting conductor and the wiring conductor are electrically coupled to each other. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between forming areas of the component mounting conductors. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between the forming areas of the component mounting conductors.
申请公布号 JP5915743(B2) 申请公布日期 2016.05.11
申请号 JP20140522607 申请日期 2013.06.24
申请人 株式会社村田製作所 发明人 福光 政和;芳井 義治
分类号 H01L23/12;H01L33/62;H05K3/34 主分类号 H01L23/12
代理机构 代理人
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