发明名称 SUBSTRATE SEGMENTATION METHOD
摘要 PROBLEM TO BE SOLVED: To stably segment a substrate along lines crossing each other in a plane layout.SOLUTION: A first trench line TL1 is formed by sliding a tip pressed to a first main face SF1 of a first brittle substrate 11. The first trench lie TL1 is formed so as to get a crack free state. A first crack line CL1 is formed by extending a crack along the first trench line TL1. Continuity of the first brittle substrate 11 is broken by the first crack line CL1 in the direction crossing the first trench line TL1 right under the first trench line TL1. A second crack line CL2 is formed on a second main face SF2. The first brittle substrate 11 is segmented along each of the first and the second crack lines CL1 and CL2.SELECTED DRAWING: Figure 2
申请公布号 JP2016069195(A) 申请公布日期 2016.05.09
申请号 JP20140196494 申请日期 2014.09.26
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SOYAMA HIROSHI
分类号 C03B33/02;B28D5/00 主分类号 C03B33/02
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