| 摘要 |
Provided are a method for surface mounting an electronic component, in which a solder material is not used, and generation of cracks in a joint interface can be suppressed, and a substrate having the electronic component mounted thereon. The method for surface mounting an electronic component 40 includes the steps of: providing, on an insulating base material 10, a conductive circuit 21, and a resist 30, which is formed on a front surface of the conductive circuit 21, and which is made of a thermoplastic resin; providing a surface of the electrode 41 of an electronic component 40 with a metal layer 50; and bonding the metal layer 50 of the electronic component 40 and the conductive circuit 21 to each other by melting and partially removing the resist 30 by applying a load generated by ultrasonic vibration that vibrates in a direction substantially parallel to a surface of the metal layer 50, while pressing the metal layer 50 to the resist 30, and then stopping the application of the load generated by the ultrasonic vibration, and hardening a thermoplastic resin by cooling. The metal layer 50 is configured by a thin layer made of a material having a shear strength lower than that of a material constituting the conductive circuit 21. |
