| 发明名称 |
PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING |
| 摘要 |
A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint. |
| 申请公布号 |
US2016111387(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201414516963 |
申请日期 |
2014.10.17 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Dang Bing;Knickerbocker John U.;Liu Yang;Luo Yu;Wright Steven L. |
| 分类号 |
H01L23/00;H01L25/00;H01L21/66;H01L21/56;H01L23/31;H01L21/683;H01L25/065;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
an electrical interconnection between a first substrate comprising a plurality of protrusions and a second substrate comprising a plurality of solder bumps, wherein the plurality of protrusions comprises sharp tips that penetrate the plurality of solder bumps, wherein a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps comprising a metallurgical joint. |
| 地址 |
Armonk NY US |
