SUBSTRATE WITH COOLER FOR POWER MODULES AND METHOD FOR PRODUCING SAME

摘要

Provided is a substrate with a cooler for power modules, which is prevented from the occurrence of deformation during brazing of a metal layer that is formed from copper or a copper alloy to a cooler that is formed from aluminum, and which has low thermal resistance and high bonding reliability. A circuit layer that is formed from copper or a copper alloy is bonded to one surface of a ceramic substrate, while bonding a metal layer that is formed from copper or a copper alloy to the other surface of the ceramic substrate. A second metal layer that is formed from aluminum or an aluminum alloy is bonded to the metal layer by solid-phase diffusion, and a cooler that is formed form an aluminum alloy is joined to the second metal layer by brazing with use of an Mg-containing Al-based brazing filler material.