发明名称 Scanning measurement of Seebeck coefficient of a heated sample
摘要 A novel scanning Seebeck coefficient measurement technique is disclosed utilizing a cold scanning thermocouple probe tip on heated bulk and thin film samples. The system measures variations in the Seebeck coefficient within the samples. The apparatus may be used for two dimensional mapping of the Seebeck coefficient on the bulk and thin film samples. This technique can be utilized for detection of defective regions, as well as phase separations in the sub-mm range of various thermoelectric materials.
申请公布号 US9316545(B2) 申请公布日期 2016.04.19
申请号 US201213547006 申请日期 2012.07.11
申请人 California Institute of Technology 发明人 Snyder G. Jeffrey;Iwanaga Shiho
分类号 G01K7/00;G01K7/02;G01N25/72 主分类号 G01K7/00
代理机构 Canady & Lortz LLP 代理人 Canady & Lortz LLP ;Lortz Bradley K.
主权项 1. An apparatus for measuring a Seebeck coefficient of a sample, comprising: a mount stage for the sample, the mount stage having a heater for heating a back surface of the sample; a first un-heated thermocouple probe having a first contact point where temperature and voltage are measured; a second thermocouple probe having a second contact point where temperature and voltage are measured, the second contact point disposed at a fixed point against the sample distal from the first contact point; and a motorized stage supporting the first thermocouple probe for positioning the first contact point of the first thermocouple probe at different locations on a front surface of the sample; wherein contact between the first thermocouple probe and the sample creates a local cold spot at the first contact point on the sample and the Seebeck coefficient of the sample proximate to the second thermocouple probe for each of the different locations on the front surface of the sample.
地址 Pasadena CA US